| US 7,465,088 B2 | ||
| Thermal sensing system | ||
| Gino S. Garcia, Edmonds, Wash. (US); Anthony E. Hillyerd, Sammamish, Wash. (US); James C. Marshall, Puyallap, Wash. (US); and Michael Schwager, Bellevue, Wash. (US) | ||
| Assigned to Microsoft Corporation, Remond, Wash. (US) | ||
| Filed on Jun. 22, 2006, as Appl. No. 11/425,926. | ||
| Prior Publication US 2007/0296541 A1, Dec. 27, 2007 | ||
| Int. Cl. G01N 25/00 (2006.01); G01K 1/14 (2006.01); H01M 2/18 (2006.01) | ||
| U.S. Cl. 374—153 [374/208; 374/4; 320/150; 429/121] | 20 Claims |
| 1. A thermal sensing system, comprising:
a thermally emitting object;
a one-piece clip contacting the thermally emitting object and formed of a thermally conductive material, the one-piece clip
comprising:
a plurality of tabs substantially perpendicular to a generally flat portion configured for directly connecting the one-piece
clip to a printed circuit board, wherein the plurality of tabs are in direct physical contact with the printed circuit board
and protrude through it;
a vertical stem extending downward from the generally flat portion; and
a contact portion extending from the vertical stem that conforms to a three-dimensional shape of the thermally emitting object
and is in contact with an outer surface of the thermally emitting object; and
a thermistor in thermal contact with the one-piece clip portion and the printed circuit board, wherein the thermistor is configured
for sensing the temperature of the thermally emitting object.
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