| US 7,464,719 B2 | ||
| Multi-menisci processing apparatus | ||
| James P. Garcia, Santa Clara, Calif. (US); Mike Ravkin, Sunnyvale, Calif. (US); Carl Woods, Aptos, Calif. (US); Fred C. Redeker, Fremont, Calif. (US); and John de Larios, Palo Alto, Calif. (US) | ||
| Assigned to Lam Research Corporation, Fremont, Calif. (US) | ||
| Filed on May 18, 2006, as Appl. No. 11/437,891. | ||
| Application 11/437891 is a division of application No. 10/404270, filed on Mar. 31, 2003, granted, now 7,069,937. | ||
| Application 10/404270 is a continuation in part of application No. 10/330843, filed on Dec. 24, 2002, granted, now 7,198,055. | ||
| Application 10/330843 is a continuation in part of application No. 10/261839, filed on Sep. 30, 2002, granted, now 7,234,477. | ||
| Prior Publication US 2006/0207636 A1, Sep. 21, 2006 | ||
| Int. Cl. B08B 3/00 (2006.01); B08B 7/04 (2006.01) | ||
| U.S. Cl. 134—95.2 [134/99.1; 134/102.3; 134/902] | 10 Claims |
| 1. A manifold for use in preparing a wafer surface, comprising:
a first process window in a first portion of the manifold being configured generate a first fluid meniscus on the wafer surface,
the first portion defining a first manifold surface that is configured to be held in close proximity to the wafer surface
so as to contain the first fluid meniscus between the first manifold surface and the wafer surface; and
a second process window in a second portion of the manifold being configured to generate a second fluid meniscus on the wafer
surface, the second portion defining a second manifold surface that is confi2ured to be held in close proximity to the wafer surface so as to contain the second meniscus between the second manifold surface
and the wafer surface
wherein the first portion of the manifold and the second portion of the manifold are arranged on a same side of the wafer
surface such that movement of the wafer surface acts to move the first fluid meniscus and the second fluid meniscus simultaneously
over a different portion of the wafer surface.
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