US 7,463,496 B2
	Low-profile board level EMI shielding and thermal management apparatus and spring clips for use therewith
Kenneth M. Robinson, Effort, Pa. (US); and James E. Kline, Blairstown, N.J. (US)
Assigned to Laird Technologies, Inc., St. Louis, Mo. (US)
Filed on May 01, 2006, as Appl. No. 11/415,461.
Claims priority of provisional application 60/780797, filed on Mar. 09, 2006.
Prior Publication US 2007/0211445 A1, Sep. 13, 2007
Int. Cl. H05K 9/00 (2006.01)

U.S. Cl. 361—818  [361/816]

36 Claims

1. A low-profile apparatus for providing board level EMI shielding and dissipating heat from one or more electrical components of a board, the apparatus comprising a resiliently compressible EMI gasket having a perimeter, a heat sink, and a generally inverted U-shaped spring clip including resilient legs, the resilient legs having feet for engaging the board, whereby engagement of the feet with the board applies a clamping force for compressively biasing the heat sink and the resiliently compressive EMI gasket generally towards the board, wherein the resilient legs include upper and lower stops configured for cooperatively capturing at least a portion of the board therebetween, and wherein the feet are configured for positioning through corresponding holes in the board to thereby allow the upper and lower stops to be positioned along generally opposite upper and lower surface portions of the board.