| US 7,462,940 B2 | ||
| Semiconductor component comprising flip chip contacts with polymer cores and method of producing the same | ||
| Michael Bauer, Nittendorf (Germany); Alfred Haimerl, Sinzing (Germany); Angela Kessler, Regensburg (Germany); Joachim Mahler, Regensburg (Germany); and Wolfgang Schober, Amberg (Germany) | ||
| Assigned to Infineon Technologies AG, Neubiberg (Germany) | ||
| Filed on Jan. 08, 2007, as Appl. No. 11/620,784. | ||
| Claims priority of application No. 10 2006 001 600 (DE), filed on Jan. 11, 2006. | ||
| Prior Publication US 2007/0182021 A1, Aug. 09, 2007 | ||
| Int. Cl. H01L 23/50 (2006.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01); H01L 21/00 (2006.01) | ||
| U.S. Cl. 257—778 [257/E23.021; 257/E23.008; 257/E21.503; 257/E23.004; 257/E23.069; 257/734; 257/737; 257/738; 257/692; 257/693; 257/772; 257/779; 438/108] | 15 Claims |
| 1. A semiconductor component, comprising:
a semiconductor chip comprising a wiring structure including at least one metallization layer with contact areas and at least
one dielectric insulation layer comprising a low-k material having a relative permittivity εr that is lower than the relative permittivity of a silicon oxide; and
flip-chip contacts arranged on the contact areas of the metallization layer, the flip-chip contacts comprising a polymer core
surrounded by a lead-free solder material.
|