| US 7,462,831 B2 | ||
| Systems and methods for bonding | ||
| Roland W. Gooch, Dallas, Tex. (US); Athanasios J. Syllaios, Richardson, Tex. (US); Thomas R. Schimert, Ovilla, Tex. (US); and William L. McCardel, Plano, Tex. (US) | ||
| Assigned to L-3 Communications Corporation, New York, N.Y. (US) | ||
| Filed on Nov. 30, 2006, as Appl. No. 11/607,087. | ||
| Claims priority of provisional application 60/762252, filed on Jan. 26, 2006. | ||
| Prior Publication US 2007/0170360 A1, Jul. 26, 2007 | ||
| Int. Cl. G01J 5/00 (2006.01) | ||
| U.S. Cl. 250—338.1 | 39 Claims |
| 1. A method of bonding a first wafer to a second wafer, comprising:
first segmenting at least a portion of said first wafer into multiple portions;
then simultaneously assembling said segmented multiple portions of said first wafer to at least a portion of a second wafer
that is unsegmented; and
then bonding said segmented multiple portions of said first wafer to at least a portion of said second wafer that is unsegmented.
|