US 7,462,243 B2
Chemical processing system and method
Arthur H Laflamme, Jr., Rowley, Mass. (US); Jay Wallace, Danvers, Mass. (US); and Eric Strang, Chandler, Ariz. (US)
Assigned to Tokyo Electron Limited, (Japan)
Filed on Sep. 23, 2005, as Appl. No. 11/233,077.
Application 11/233077 is a continuation of application No. PCT/US2004/008872, filed on Mar. 23, 2004.
Claims priority of provisional application 60/457326, filed on Mar. 26, 2003.
Prior Publication US 2006/0090850 A1, May 04, 2006
Int. Cl. H01L 21/00 (2006.01); C23C 16/00 (2006.01); C23C 14/00 (2006.01)
U.S. Cl. 118—715  [156/345.33; 156/345.34] 44 Claims
OG exemplary drawing
 
1. A chemical processing system, comprising:
a processing chamber containing a chemical processing region;
a gas injection system configured to inject process gas into the chemical processing region,
the gas injection system comprising
a first process gas injector including at least one first gas injection orifice therein in communication with the chemical processing region;
the first process gas injector being configured to inject the first process gas into the chemical processing region through the at least one first gas injection orifice to allow exposure of a substrate to the first process gas;
a second process gas injector including at least one second gas injection orifice therein in communication with the chemical processing region;
the second process gas injector being configured to inject the second process gas into the chemical processing region through the at least one second gas injection orifice to allow exposure of the substrate to the second process gas; and
at least one gas injection shroud coupled to at least one of the first gas injection orifice and the second gas injection orifice,
wherein the first and second gas injection orifices are angled relative to each other, and the at least one gas injection shroud is movable with respect to the at least one of the first gas injection orifice and the second gas injection orifice.