| US 7,461,614 B2 | ||
| Method and apparatus for improved baffle plate | ||
| Steven T Fink, Mesa, Ariz. (US); Eric J Strang, Chandler, Ariz. (US); Arthur H Laflamme, Jr., Rowley, Mass. (US); Jay Wallace, Danvers, Mass. (US); and Sandra Hyland, Falls Church, Va. (US) | ||
| Assigned to Tokyo Electron Limited, (Japan) | ||
| Filed on Nov. 12, 2003, as Appl. No. 10/705,224. | ||
| Prior Publication US 2005/0098265 A1, May 12, 2005 | ||
| Int. Cl. C23C 4/10 (2006.01); H01L 21/205 (2006.01) | ||
| U.S. Cl. 118—723E [118/723 ER; 156/345.51] | 11 Claims |
| 1. A baffle plate assembly for surrounding a substrate holder in a plasma processing system comprising:
a centering ring configured to be coupled to said substrate holder, wherein at least a portion of said centering ring extends
radially outside a periphery of said substrate holder; and
a removable baffle plate comprising one or more passageways, wherein said baffle plate is configured to be centered within
said plasma processing system by removably coupling said baffle plate to said portion of said centering ring extending radially
outside said periphery of said substrate holder, and
wherein said centering ring comprises a centering feature configured to center said baffle plate on said centering ring.
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