US 11,839,159 B2
Transducer with improved piezoelectric arrangement, mems device comprising the transducer, and methods for manufacturing the transducer
Luca Seghizzi, Milan (IT); Federico Vercesi, Milan (IT); and Claudia Pedrini, Seriate (IT)
Assigned to STMICROELECTRONICS S.r.l., Agrate Brianza (IT)
Filed by STMicroelectronics S.r.l., Agrate Brianza (IT)
Filed on Oct. 14, 2020, as Appl. No. 17/070,548.
Claims priority of application No. 102019000019058 (IT), filed on Oct. 16, 2019.
Prior Publication US 2021/0119105 A1, Apr. 22, 2021
Int. Cl. H01L 41/083 (2006.01); H10N 30/50 (2023.01); H10N 30/03 (2023.01); H10N 30/09 (2023.01); H10N 30/30 (2023.01)
CPC H10N 30/50 (2023.02) [H10N 30/03 (2023.02); H10N 30/09 (2023.02); H10N 30/306 (2023.02)] 20 Claims
OG exemplary drawing
 
1. A transducer, comprising:
a supporting body including:
a first structural region having a first sidewall; and
a second structural region including a second sidewall spaced outward from the first sidewall;
a suspended structure, mechanically coupled to the supporting body, having a first and a second surface opposite to one another along an axis transverse to the first and second surfaces;
a recess defined by the first structural region, the second sidewall of the second structural region, and the second surface of the suspended structure;
a first piezoelectric transducer on the first surface of the suspended structure; and
a second piezoelectric transducer on the second surface of the suspended structure, the second piezoelectric transducer is at least partially within the recess.