US 11,838,905 B2
Sidelink beam failure detection
Jung Ho Ryu, Fort Lee, NJ (US); Ling Ding, Chester, NJ (US); Sony Akkarakaran, Poway, CA (US); Kiran Venugopal, Green Brook, NJ (US); Tianyang Bai, Somerville, NJ (US); Junyi Li, Fairless Hills, PA (US); and Tao Luo, San Diego, CA (US)
Assigned to QUALCOMM Incorporated, San Diego, CA (US)
Filed by QUALCOMM Incorporated, San Diego, CA (US)
Filed on Oct. 6, 2022, as Appl. No. 17/938,453.
Application 17/938,453 is a continuation of application No. 17/248,162, filed on Jan. 12, 2021, granted, now 11,483,835.
Claims priority of provisional application 62/969,544, filed on Feb. 3, 2020.
Prior Publication US 2023/0036526 A1, Feb. 2, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H04W 72/04 (2023.01); H04W 72/044 (2023.01); H04B 7/0408 (2017.01)
CPC H04W 72/046 (2013.01) [H04B 7/0408 (2013.01)] 30 Claims
OG exemplary drawing
 
1. A first node for wireless communication, comprising:
a memory; and
one or more processors, coupled to the memory, configured to:
transmit, to a second node and on a beamformed link from the first node to the second node, a first signal; and
perform a sidelink beam failure recovery procedure based at least in part on a second signal, associated with the first signal, not being received on a beamformed link from the second node to the first node,
wherein the beamformed link from the first node to the second node and the beamformed link from the second node to the first node are a same link.