CPC H01L 29/6684 (2013.01) [H01L 21/02532 (2013.01); H01L 21/02554 (2013.01); H01L 21/02667 (2013.01); H01L 21/67098 (2013.01)] | 20 Claims |
1. A system for processing semiconductor wafers, the system comprising:
a processing chamber;
a substrate holder configured to support a semiconductor wafer;
a heating element configured to heat the semiconductor wafer supported by the substrate holder;
a first electrode configured to be detachably attached to a first major surface of the semiconductor wafer;
a first wire coupling the first electrode to a first potential node; and
a load-rail configured to detachably attach the first electrode to the first major surface of the semiconductor wafer and load the semiconductor wafer into the processing chamber.
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