US 11,837,560 B2
Semiconductor device with waveguide and method therefor
Michael B. Vincent, Chandler, AZ (US); Giorgio Carluccio, Eindhoven (NL); Maristella Spella, Eindhoven (NL); and Scott M. Hayes, Chandler, AZ (US)
Assigned to NXP USA, INC., Austin, TX (US)
Filed by NXP USA, INC., Austin, TX (US)
Filed on Aug. 26, 2021, as Appl. No. 17/412,687.
Application 17/412,687 is a division of application No. 16/716,680, filed on Dec. 17, 2019, granted, now 11,133,273.
Prior Publication US 2021/0391285 A1, Dec. 16, 2021
Int. Cl. H01L 23/66 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01Q 1/22 (2006.01)
CPC H01L 23/66 (2013.01) [H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/565 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 23/3128 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01Q 1/2283 (2013.01); H01L 2221/68372 (2013.01); H01L 2223/6627 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/214 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of manufacturing a semiconductor device, the method comprising:
forming an assembly comprising:
placing a semiconductor die and a launcher structure on a carrier substrate, the launcher structure including an antenna launcher;
encapsulating at least a portion of the semiconductor die and the launcher structure;
applying a redistribution layer on a first major surface of the semiconductor die and a first major surface of the launcher structure, a bond pad of the semiconductor die connected by way of the redistribution layer to the antenna launcher;
attaching the assembly to a substrate; and
attaching a waveguide structure to the substrate, the waveguide structure overlapping the assembly and physically decoupled from the assembly.