CPC H01L 23/38 (2013.01) [H10N 10/17 (2023.02); H10N 10/80 (2023.02)] | 12 Claims |
1. A cooling device for integrated circuits, the device comprising:
a plurality TEC cooling cells arranged in an array, wherein each of the cells includes a controller coupled to at least one TEC device;
a single power connector that provides power to all the cells in the array;
wherein the controller of each cell in the array is operable to control the at least one TEC it is coupled to with power received from the single power connector; and
one or more alignment elements on each of the plurality of TEC cooling cells.
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