US 11,837,524 B2
Localized targeted thermoelectric cooling thermal control of integrated circuits with sub-device scale resolution
Paul T. Hartin, McKinney, TX (US); Kalin Spariosu, Thousand Oaks, CA (US); Thomas T. Leise, Collinsville, TX (US); David A. Vasquez, Gardena, CA (US); and Michael R. Patrizi, Lancaster, MA (US)
Assigned to RAYTHEON COMPANY, Waltham, MA (US)
Filed by Raytheon Company, Waltham, MA (US)
Filed on Jun. 21, 2021, as Appl. No. 17/352,612.
Prior Publication US 2022/0406680 A1, Dec. 22, 2022
Int. Cl. H01L 23/38 (2006.01); H10N 10/17 (2023.01); H10N 10/80 (2023.01)
CPC H01L 23/38 (2013.01) [H10N 10/17 (2023.02); H10N 10/80 (2023.02)] 12 Claims
OG exemplary drawing
 
1. A cooling device for integrated circuits, the device comprising:
a plurality TEC cooling cells arranged in an array, wherein each of the cells includes a controller coupled to at least one TEC device;
a single power connector that provides power to all the cells in the array;
wherein the controller of each cell in the array is operable to control the at least one TEC it is coupled to with power received from the single power connector; and
one or more alignment elements on each of the plurality of TEC cooling cells.