US 11,835,539 B2
Low heat-resistant sensor
Hisataka Satoh, Gojo (JP); and Tetsuya Komeda, Gojo (JP)
Assigned to VALQUA, LTD., Tokyo (JP)
Appl. No. 17/769,007
Filed by Valqua, Ltd., Tokyo (JP)
PCT Filed Sep. 28, 2020, PCT No. PCT/JP2020/036579
§ 371(c)(1), (2) Date Apr. 14, 2022,
PCT Pub. No. WO2021/075248, PCT Pub. Date Apr. 22, 2021.
Claims priority of application No. 2019-190082 (JP), filed on Oct. 17, 2019.
Prior Publication US 2023/0160919 A1, May 25, 2023
Int. Cl. G01P 1/02 (2006.01); G01D 11/24 (2006.01); G01P 5/08 (2006.01); G01P 15/08 (2006.01)
CPC G01P 1/023 (2013.01) [G01D 11/245 (2013.01); G01P 1/02 (2013.01); G01P 15/08 (2013.01); G01P 15/0802 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A low heat-resistant sensor comprising:
a sensor body that includes a sensor unit that is disposed in a housing, wherein the housing includes:
a container that contains the sensor unit in a recessed portion and that is composed of fluorine resin,
a plate that serves as a lid covering an opening of the recessed portion and that is composed of fluorine resin, and
a frame body that is disposed such that the frame body surrounds a perimeter of the plate and that is composed of fluorine resin,
wherein the frame body and the container are thermally bonded to each other, and the frame body and the plate are thermally bonded to each other; and
a cable that is electrically connected to the sensor unit of the sensor body,
wherein the housing of the sensor body is composed of fluorine resin, and the cable is covered by a tube composed of fluorine resin, and
wherein a portion at which the housing and the tube are connected to each other is thermally bonded, and the housing and the tube are integrally formed.