US 11,834,704 B2
Microarray fabrication system and method
M. Shane Bowen, Encinitas, CA (US); Kevin L. Gunderson, Encinitas, CA (US); Shengrong Lin, Fremont, CA (US); Maria Candelaria Rogert Bacigalupo, Cardiff by the Sea, CA (US); Kandaswamy Vijayan, San Diego, CA (US); Yir-Shyuan Wu, Albany, CA (US); Bala Murali Venkatesan, San Francisco, CA (US); James Tsay, San Diego, CA (US); John M. Beierle, Carlsbad, CA (US); Lorenzo Berti, San Diego, CA (US); and Sang Ryul Park, San Diego, CA (US)
Assigned to Illumina, Inc., San Diego, CA (US)
Filed by ILLUMINA, INC., San Diego, CA (US)
Filed on Dec. 7, 2020, as Appl. No. 17/113,180.
Application 17/113,180 is a division of application No. 16/118,268, filed on Aug. 30, 2018, granted, now 11,060,135.
Application 16/118,268 is a division of application No. 15/470,577, filed on Mar. 27, 2017, granted, now 10,280,454, issued on May 7, 2019.
Application 15/470,577 is a division of application No. 14/194,143, filed on Feb. 28, 2014, granted, now 9,670,535, issued on Jun. 6, 2017.
Application 14/194,143 is a division of application No. 13/661,524, filed on Oct. 26, 2012, granted, now 8,778,849, issued on Jul. 15, 2014.
Claims priority of provisional application 61/552,712, filed on Oct. 28, 2011.
Prior Publication US 2021/0108258 A1, Apr. 15, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. C12Q 1/6844 (2018.01); C40B 50/18 (2006.01); C12Q 1/686 (2018.01); B01J 19/00 (2006.01); C40B 40/06 (2006.01)
CPC C12Q 1/6844 (2013.01) [B01J 19/0046 (2013.01); C12Q 1/686 (2013.01); C40B 50/18 (2013.01); B01J 2219/00529 (2013.01); B01J 2219/00608 (2013.01); B01J 2219/00621 (2013.01); B01J 2219/00637 (2013.01); B01J 2219/00641 (2013.01); B01J 2219/00644 (2013.01); B01J 2219/00648 (2013.01); B01J 2219/00653 (2013.01); B01J 2219/00659 (2013.01); B01J 2219/00662 (2013.01); B01J 2219/00722 (2013.01); B01J 2219/00788 (2013.01); C40B 40/06 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A method comprising:
forming a patterned substrate that comprises a plurality of base pads, using a nano-imprint lithography process, wherein forming the patterned substrate comprises:
forming a transfer layer on a substrate die;
forming an imprint resist layer on the transfer layer;
contacting the imprint resist layer with a working mold, the working mold comprising a plurality of lands separated by recessed portions, and creating in the imprint resist layer a plurality of imprint resist regions separated by transfer regions at which portions of the transfer layer are exposed from the imprint resist layer;
at least partially curing the imprint resist regions;
removing the exposed portions of the transfer layer at the transfer regions so as to expose portions of the substrate die;
depositing a deposition material on the imprint resist regions and the exposed portions of the substrate die so as to form the base pads on the substrate die; and
removing portions of the transfer layer, imprint resist layer, and deposition material from the substrate die at locations other than the base pads; and
attaching a capture substance to each of the plurality of base pads, optionally through a linker, the capture substance being adapted to promote capture of a target molecule.