| US 7,460,003 B2 | ||
| Electronic fuse with conformal fuse element formed over a freestanding dielectric spacer | ||
| Louis Lu-Chen Hsu, Fishkill, N.Y. (US); Jack A. Mandelman, Flat Rock, N.C. (US); William R. Tonti, Essex Junction, Vt. (US); and Chih-Chao Yang, Poughkeepsie, N.Y. (US) | ||
| Assigned to International Business Machines Corporation, Armonk, N.Y. (US) | ||
| Filed on Mar. 09, 2006, as Appl. No. 11/372,387. | ||
| Prior Publication US 2007/0210890 A1, Sep. 13, 2007 | ||
| Int. Cl. H01H 85/08 (2006.01); H01L 23/62 (2006.01) | ||
| U.S. Cl. 337—159 [337/187; 29/623; 257/529] | 6 Claims |
| 1. A method of fabricating a fuse for an integrated circuit, the method comprising:
forming an at least partially freestanding dielectric spacer above a supporting structure;
conformably forming a fuse element of the fuse over at least a portion of the freestanding dielectric spacer, wherein the
fuse element has a convex upper surface and a lower surface with a radius of curvature at a smallest surface area of curvature
less than or equal to 100 nanometers; and
wherein the freestanding dielectric spacer is a sacrificial spacer, and wherein the method further comprises removing the
sacrificial spacer after conformably forming the fuse element over the at least a portion thereof to define a void underneath
the fuse element.
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