| US 7,459,774 B2 | ||
| Stacked chip package using photosensitive polymer and manufacturing method thereof | ||
| Yong-Chai Kwon, Suwon (Korea, Republic of); Kang-Wook Lee, Suwon (Korea, Republic of); Keum-Hee Ma, Andong (Korea, Republic of); and Seong-II Han, Suwon (Korea, Republic of) | ||
| Assigned to Samsung Electronics Co., Ltd., (Korea, Republic of) | ||
| Filed on May 18, 2006, as Appl. No. 11/436,851. | ||
| Claims priority of application No. 10-2005-0080655 (KR), filed on Aug. 31, 2005. | ||
| Prior Publication US 2007/0048969 A1, Mar. 01, 2007 | ||
| Int. Cl. H01L 23/02 (2006.01) | ||
| U.S. Cl. 257—686 [257/777; 257/E25.006; 257/E25.013; 257/E25.018; 257/E25.021; 257/E25.027; 257/E25.085] | 13 Claims |
| 1. A semiconductor device comprising:
a first semiconductor device on a first substrate, the first semiconductor device including a first bonding pad on a first
surface of the first substrate in a device region of the first semiconductor device;
a first interconnect on the first surface of the first substrate, the first interconnect electrically coupled to the first
bonding pad,
a conductive via through the first substrate, the conductive via being electrically coupled to the first interconnect, a portion
of the conductive via extending from a second surface of the first substrate opposite the first surface;
a second semiconductor device on a second substrate, the second semiconductor device including a second bonding pad on a first
surface of the second substrate in a device region of the second semiconductor device, the second substrate separated from
the first substrate by a space between the first surface of the second substrate and the second surface of the first substrate;
a second interconnect on the first surface of the second substrate, the second interconnect electrically coupled to the second
bonding pad; and
a photosensitive polymer layer filling the space between the first surface of the second substrate and the second surface
of the first substrate, and bonding the first and second substrates to each other, the portion of the conductive via extending
from the second surface of the first substrate further extending through the photosensitive polymer layer and contacting the
second interconnect to electrically couple the first bonding pad to the second bonding pad.
|