| US 7,459,264 B2 | ||
| Device manufacturing method | ||
| Daisuke Kawamura, Yokohama (Japan); Akiko Mimotogi, Yokohama (Japan); and Takashi Sato, Fujisawa (Japan) | ||
| Assigned to Kabushiki Kaisha Toshiba, Tokyo (Japan) | ||
| Filed on Jul. 07, 2005, as Appl. No. 11/175,275. | ||
| Claims priority of application No. 2004-200610 (JP), filed on Jul. 07, 2004. | ||
| Prior Publication US 2006/0008747 A1, Jan. 12, 2006 | ||
| Int. Cl. G03F 7/26 (2006.01) | ||
| U.S. Cl. 430—311 [430/330] | 14 Claims |
| 1. A device manufacturing method comprising:
forming a resist film on a substrate;
preparing an exposure tool which comprises a projection optical system;
preparing a photo mask on which a mask pattern is formed;
mounting the substrate and the photo mask on the exposure tool, the substrate having the resist film formed thereon;
transferring the mask pattern formed on the photo mask onto the resist film in a state in which a solution including an oxidative
agent is filled between the resist film and a final element of the projection optical system to form a latent image of the
mask pattern on the resist film;
heating the resist film having the latent image formed thereon; and
developing the heated resist film.
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