| US 7,459,202 B2 | ||
| Printed circuit board | ||
| Jaroslaw A. Magera, Palatine, Ill. (US); and Gregory J. Dunn, Arlington Heights, Ill. (US) | ||
| Assigned to Motorola, Inc., Schaumburg, Ill. (US) | ||
| Filed on Jul. 03, 2006, as Appl. No. 11/428,454. | ||
| Prior Publication US 2008/0003414 A1, Jan. 03, 2008 | ||
| Int. Cl. B32B 15/00 (2006.01); H05K 1/00 (2006.01) | ||
| U.S. Cl. 428—209 [174/250; 174/255; 174/261; 174/264] | 17 Claims |
| 1. A printed circuit board, comprising:
a deformed thermoset dielectric medium, comprising a polymer, having a major surface;
one or more apertures formed in the deformed thermoset dielectric medium, each aperture having a layer of copper deposited
on aperture walls thereof;
a copper flange embedded into the major surface of the deformed thermoset dielectric medium and substantially concentric to
a central axis of the aperture, wherein interior vertical walls of the flange are attached to an outer portion of the layer
of copper on the aperture wall,wherein the thickness of the copper flange is equal to or greater than two times the thickness
of the layer of copper on the aperture walls; and
a copper foil situated on at least portions of the major surface of the deformed thermoset dielectric medium, with portions
of the copper foil overlying the copper flange.
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