| US 7,459,031 B2 | ||
| Method for producing Nb3Sn superconductive wire material using powder process | ||
| Takayoshi Miyazaki, Kobe (Japan); Hiroyuki Kato, Kobe (Japan); Kyoji Zaitsu, Kobe (Japan); and Kyoji Tachikawa, Hiratsuka (Japan) | ||
| Assigned to Kabushiki Kaisha Kobe Seiko Sho, Hyogo (Japan) | ||
| Appl. No. 11/661,695 PCT Filed Sep. 12, 2005, PCT No. PCT/JP2005/016772 § 371(c)(1), (2), (4) Date Mar. 02, 2007, PCT Pub. No. WO2006/030744, PCT Pub. Date Mar. 23, 2006. |
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| Claims priority of application No. 2004-268703 (JP), filed on Sep. 15, 2004. | ||
| Prior Publication US 2008/0092992 A1, Apr. 24, 2008 | ||
| This patent is subject to a terminal disclaimer. | ||
| Int. Cl. H01L 39/24 (2006.01) | ||
| U.S. Cl. 148—98 [419/34; 29/599] | 2 Claims |
| 1. A method for producing an Nb3Sn superconductive wire material using a powder process, comprising: filling a powdered raw material in a sheath made of Nb
or an Nb-based alloy, subjecting the sheath to diameter reduction to form a wire, and performing heat treatment for the wire
to form a superconductive layer at the interface between the sheath and the filled powder,
wherein the powdered raw material contains powdered Sn, powdered Cu, and a powdered alloy or powdered intermetallic compound,
which is formed from Sn and at least one metal selected from the group consisting of Ti, Zr, Hf, V, and Ta, respectively,
and
when the amount of the powdered alloy or the powdered intermetallic compound is assumed to be 100, the amounts of the powdered
Sn and the powdered Cu in the powdered raw material are 15 to 90 mass percent and 1 to 20 mass percent, respectively.
|