| US 7,458,498 B2 | ||
| Semiconductor device and a wire bonding method | ||
| Tatsunari Mii, Tachikawa (Japan); and Shinichi Akiyama, Akiruno (Japan) | ||
| Assigned to Kabushiki Kaisha Shinkawa, Tokyo (Japan) | ||
| Filed on Jun. 28, 2004, as Appl. No. 10/879,566. | ||
| Claims priority of application No. 2003-183918 (JP), filed on Jun. 27, 2003; and application No. 2004-066541 (JP), filed on Mar. 10, 2004. | ||
| Prior Publication US 2004/0262369 A1, Dec. 30, 2004 | ||
| Int. Cl. B23K 31/02 (2006.01) | ||
| U.S. Cl. 228—180.5 | 1 Claim |
| 1. A wire bonding method that connects a first bonding point and a second bonding point by a wire, said method comprising,
in the order stated, steps of:
a step that press-bonds a ball formed on a tip end of a wire to a first bonding point, thus forming a press-banded ball; then
a step that raises a capillary; then
a step that moves the capillary toward a second bonding point; then
a step that then lowers the capillary by an amount that is smaller than an amount in which the capillary was raised to form
a bent portion in said wire; then
a step that raises the capillary to allow the wire to be paid out of the capillary; and then
a step that moves the capillary toward a second bonding point, thus connecting the wire to the second bonding point.
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