| US 7,458,412 B2 | ||
| Method of forming a housing having a thin wall and the housing | ||
| Hiroaki Hirao, Ome (Japan) | ||
| Assigned to Kabushiki Kaisha Toshiba, Tokyo (Japan) | ||
| Filed on Mar. 16, 2006, as Appl. No. 11/376,893. | ||
| Claims priority of application No. 2005-118640 (JP), filed on Apr. 15, 2005. | ||
| Prior Publication US 2006/0231230 A1, Oct. 19, 2006 | ||
| Int. Cl. B22D 29/00 (2006.01); B22D 17/22 (2006.01) | ||
| U.S. Cl. 164—131 [164/347] | 14 Claims |
| 1. A method of forming a housing having a plurality of peripheral walls attached to a top wall that is positioned under components
contained within the housing, the method comprising:
preparing a pair of metal molds;
filling a molten material into a molding space defined between the metal molds, and thereby molding a molded article having
a shape corresponding to the housing, the molded article having a plurality of pin-receiving portions formed in a planar orientation
and as part of a partition wall that is different than any of the plurality of peripheral walls, the partition wall being
formed as an unitary piece of the housing and projecting upwardly from an internal surface of the top wall; and
ejecting the molded article from the metal molds by pushing the pin-receiving portions of the molded article by a first plurality
of ejector pins.
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