| US 7,457,123 B1 | ||
| Chassis mounted heat sink system | ||
| Michael J. Wayman, Waconia, Minn. (US) | ||
| Assigned to ADC Telecommunications, Inc., Eden Prairie, Minn. (US) | ||
| Filed on May 10, 2007, as Appl. No. 11/747,039. | ||
| Int. Cl. H05K 7/20 (2006.01) | ||
| U.S. Cl. 361—704 [361/688; 361/707; 361/709; 361/710; 165/185] | 23 Claims |
| 6. A heat sink system for an electronics enclosure, the heat sink system comprising:
a chassis for the electronics enclosure;
a top plate on the chassis, the top plate having an upper surface and a lower surface;
at least one heat sink disposed within the chassis, the heat sink comprising:
a thermal conduction section with an inner surface and an outer surface, the thermal conduction section having an extended
profile that tapers from a first end having a first thickness to a second end having a second thickness that is larger than
the first thickness;
a mounting plate contiguous with the second end, the mounting plate attached to the lower surface of the top plate; and
a thermal interface pad coupled to the outer surface of the thermal conduction section; and
wherein the heat sink provides at least one thermally conductive path to remove heat from one or more electronic components
in the electronics enclosure.
|