| US 7,457,117 B2 | ||
| System for controlling the temperature of electronic devices | ||
| Tsunwai Gary Yip, San Jose, Calif. (US); and David Nguyen, Cupertino, Calif. (US) | ||
| Assigned to Rambus Inc., Los Altos, Calif. (US) | ||
| Filed on Aug. 16, 2006, as Appl. No. 11/505,572. | ||
| Prior Publication US 2008/0043435 A1, Feb. 21, 2008 | ||
| Int. Cl. H05K 7/20 (2006.01) | ||
| U.S. Cl. 361—698 [361/699; 324/760; 62/3.3] | 41 Claims |
| 1. A system for controlling the temperature of electronic devices under test, the system comprising:
a housing configured to removably enclose an electronic device coupled to a platform;
a seal configured to be compressed directly between the housing and the platform; and
a heat transfer mechanism coupled to the housing and configured to transfer heat between the heat transfer mechanism and the
electronic device.
|