| US 7,456,506 B2 | ||
| Radio frequency identification (RFID) tag lamination process using liner | ||
| Robert R. Oberle, Macungie, Pa. (US) | ||
| Assigned to RCD Technology Inc., Quakertown, Pa. (US) | ||
| Filed on Nov. 22, 2005, as Appl. No. 11/284,761. | ||
| Application 11/284761 is a continuation in part of application No. 11/079143, filed on Mar. 14, 2005. | ||
| Prior Publication US 2006/0205115 A1, Sep. 14, 2006 | ||
| This patent is subject to a terminal disclaimer. | ||
| Int. Cl. H01L 23/48 (2006.01); H01L 21/00 (2006.01); G01V 15/00 (2006.01) | ||
| U.S. Cl. 257—784 [438/119; 343/760] | 25 Claims |
| 1. An apparatus to construct an RFID unit comprising:
a unit to attach an integrated circuit chip to a substrate with an antenna unit using an electrically conductive adhesive;
and
a unit to laminate a protective layer with a liner over at least part of the integrated circuit chip while the electrically
conductive adhesive has not yet fully set.
|