| US 7,456,449 B2 | ||
| Semiconductor apparatus, LED print head, and printer | ||
| Hiroyuki Fujiwara, Hachioji (Japan); Takahito Suzuki, Hachioji (Japan); Susumu Chihara, Hachioji (Japan); Mitsuhiko Ogihara, Hachioji (Japan); Ichimatsu Abiko, Tokyo (Japan); and Masaaki Sakuta, Tokyo (Japan) | ||
| Assigned to Oki Data Corporation, Tokyo (Japan) | ||
| Filed on Nov. 30, 2004, as Appl. No. 10/998,801. | ||
| Claims priority of application No. 2003-405682 (JP), filed on Dec. 04, 2003. | ||
| Prior Publication US 2005/0127389 A1, Jun. 16, 2005 | ||
| This patent is subject to a terminal disclaimer. | ||
| Int. Cl. H01L 27/76 (2006.01) | ||
| U.S. Cl. 257—231 [257/232; 257/233; 257/234; 257/48; 257/88; 257/72; 257/E33.055] | 15 Claims |
| 1. A semiconductor apparatus, comprising:
a semiconductor substrate including electrical circuitry that is contained within the semiconductor substrate;
a thin semiconductor film disposed on the semiconductor substrate, the thin semiconductor film being formed separately from
the semiconductor substrate and attached to the semiconductor substrate, the thin semiconductor film including at least one
semiconductor device; and
an interconnecting line disposed on respective surfaces of the thin semiconductor film and the semiconductor substrate, interconnecting
the semiconductor device with the electrical circuitry, the interconnecting line including a probe pad disposed on the semiconductor
substrate between the thin semiconductor film and the electrical circuitry, the probe pad being wider than parts of the interconnecting
line other than the probe pad, the probe pad being used for testing whether the electrical circuitry operates normally.
|