| US 7,456,113 B2 | ||
| Cleaning method and solution for cleaning a wafer in a single wafer process | ||
| Ronald Rayandayan, Union City, Calif. (US); Steven Verhaverbeke, San Francisco, Calif. (US); and Hong Wang, Cupertino, Calif. (US) | ||
| Assigned to Applied Materials, Inc., Santa Clara, Calif. (US) | ||
| Filed on Jun. 06, 2005, as Appl. No. 11/146,574. | ||
| Prior Publication US 2006/0054181 A1, Mar. 16, 2006 | ||
| Int. Cl. H01L 21/461 (2006.01) | ||
| U.S. Cl. 438—745 [438/747; 438/749; 438/751; 216/89; 216/99] | 20 Claims |
| 1. A method, comprising: stripping at least one film from a reclaimed semiconductor wafer; after stripping the at least one
film, chemically mechanically polishing the reclaimed semiconductor wafer;
cleaning the reclaimed semiconductor wafer by a batch process among a plurality of reclaimed semiconductor wafers wherein
the batch process comprises a batch pre-clean process with a SC1 bath and a SC2 bath;
after cleaning the reclaimed semiconductor wafer by the batch process, placing the reclaimed semiconductor wafer within a
single wafer cleaning tool including a wafer support for supporting a single wafer; and
cleaning the reclaimed semiconductor wafer in the single wafer cleaning tool.
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