| US 7,456,084 B2 | ||
| Method of using a setter having a recess in manufacturing a net-shape semiconductor wafer | ||
| Ralf Jonczyk, Wilmington, Del. (US); Scott L. Kendall, Lincoln University, Pa. (US); and James A. Rand, Landenberg, Pa. (US) | ||
| Assigned to Heritage Power LLC, Atlanta, Ga. (US) | ||
| Filed on Jan. 28, 2005, as Appl. No. 11/46,535. | ||
| Application 11/046535 is a continuation of application No. PCT/US03/023401, filed on Jul. 25, 2003. | ||
| Claims priority of provisional application 60/404506, filed on Aug. 19, 2002. | ||
| Claims priority of provisional application 60/399803, filed on Jul. 31, 2002. | ||
| Prior Publication US 2005/0176218 A1, Aug. 11, 2005 | ||
| Int. Cl. H01L 21/322 (2006.01) | ||
| U.S. Cl. 438—476 [438/477; 438/906; 438/958; 257/E21.002; 117/101] | 33 Claims |
| 1. A method of fabricating a wafer, comprising:
depositing at least one semiconductor material for forming the wafer into a recess provided on a first side of a setter, said
at least one semiconductor material being in solid form as it is being deposited, said recess having a recess bottom region
and a recess sidewall;
moving said setter including said recess containing said semiconductor material through a heating/cooling region, said heating/cooling
region comprising a plurality of zones in which said recess and said semiconductor material are subjected to different temperature
conditions; and
removing from said recess the wafer comprising said semiconductor material.
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