| US 7,456,053 B2 | ||
| Packaging method for segregating die paddles of a leadframe | ||
| Yonggill Lee, Kaoshiung (Taiwan); Kwangwon Koh, Kaoshiung (Taiwan); and Sangyun Lee, Kaoshiung (Taiwan) | ||
| Assigned to Advanced Semiconductor Engineering, Inc., Kaohsiung (Taiwan) | ||
| Filed on Feb. 22, 2006, as Appl. No. 11/357,952. | ||
| Claims priority of application No. 94123931 A (TW), filed on Jul. 14, 2005. | ||
| Prior Publication US 2007/0020802 A1, Jan. 25, 2007 | ||
| Int. Cl. H01L 21/48 (2006.01) | ||
| U.S. Cl. 438—124 [257/E21.499] | 20 Claims |
| 1. A packaging method for segregating die paddles of a leadframe, the method comprising the steps of:
(a) providing a leadframe having a top surface, a bottom surface and a die paddle region, the die paddle region having a plurality
of die paddles, at least two of the die paddles connected to each other by a connecting bar;
(b) attaching a plurality of dies onto the die paddles;
(c) forming a molding compound to encapsulate the dies on the die paddles and to expose a bottom surface of the connecting
bar outside the molding compound; and
(d) removing part of the connecting bar so as to segregate the connected die paddles.
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