| US 7,455,450 B2 | ||
| Method and apparatus for temperature sensing in integrated circuits | ||
| Huining Liu, Austin, Tex. (US); and Larry D. Hewitt, Austin, Tex. (US) | ||
| Assigned to Advanced Micro Devices, Inc., Sunnyvale, Calif. (US) | ||
| Filed on Oct. 07, 2005, as Appl. No. 11/246,855. | ||
| Prior Publication US 2007/0081575 A1, Apr. 12, 2007 | ||
| Int. Cl. G01K 3/00 (2006.01) | ||
| U.S. Cl. 374—111 [702/130; 702/99; 331/57] | 17 Claims |
| 1. An integrated circuit comprising:
a plurality of remote temperature sensors;
a reference sensor wherein the reference sensor and each of the plurality of remote temperature sensors include a ring oscillator;
a reference unit configured to provide a reference temperature, wherein the reference sensor is located near the reference
unit; and
a control logic unit operatively coupled to each of the plurality of remote temperature sensors and the reference unit, wherein
the control logic is configured to determine a temperature of each the plurality of temperature sensors based on the reference
temperature and a signal provided by the reference sensor and further configured to determine a maximum temperature of the
plurality of remote temperature sensors and the reference sensor;
wherein the integrated circuit is a processor having a processor core and a bridge unit, wherein each of the plurality of
remote temperature sensors are located in the processor core, and wherein the reference sensor, reference unit, and the control
logic unit are located in the bridge unit; and
wherein the ring oscillator of the reference sensor and each of the plurality of remote temperature sensors are configured
to provide an output signal within a range of frequencies, wherein a maximum frequency in the range of frequencies is at least
one order of magnitude less than a clock frequency at which the processor core operates.
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