US 7,454,835 B2
Method of manufacturing heat transfer device
Bin-Juine Huang, Taipei (Taiwan); Chern-Shi Lam, Taipei County (Taiwan); Chih-Hung Wang, Taipei County (Taiwan); Huan-Hsiang Huang, Taipei County (Taiwan); and Yu-Yuan Yen, Taichung County (Taiwan)
Assigned to Advanced Thermal Device Inc., Taipei (Taiwan)
Filed on Jan. 24, 2007, as Appl. No. 11/626,382.
Application 11/626382 is a division of application No. 10/710663, filed on Jul. 27, 2004.
Claims priority of application No. 92128972 A (TW), filed on Oct. 20, 2003.
Prior Publication US 2007/0113404 A1, May 24, 2007
Int. Cl. B23P 6/00 (2006.01); F28D 15/04 (2006.01)
U.S. Cl. 29—890.032  [29/890.036; 29/890.07; 165/104.26; 165/104.33] 7 Claims
OG exemplary drawing
 
1. A method for manufacturing a heat transfer device, comprising:
mortising a porous core into a first hollow tube;
providing a second hollow tube having a closed end, said closed end having a second surface;
hole-punching to form a second hole at said second surface;
hole-widening at an opposite end of said second hollow tube at the same time of performing said step of hole-punching to form said second hole;
mortising said second hollow tube on said first hollow tube;
covering a heat conductor on said first hollow tube; and
connecting a connecting pipe to said first hollow tube and said second hollow tube.