| US 7,453,153 B2 | ||
| Circuit device | ||
| Atsushi Saita, Kobe (Japan); Toshikazu Imaoka, Ogaki (Japan); Tetsuro Sawai, Hashima (Japan); and Yasunori Inoue, Ogaki (Japan) | ||
| Assigned to Sanyo Electric Co., Ltd., Osaka (Japan) | ||
| Filed on Mar. 29, 2006, as Appl. No. 11/391,680. | ||
| Claims priority of application No. 2005-095918 (JP), filed on Mar. 29, 2005; and application No. 2006-075340 (JP), filed on Mar. 17, 2006. | ||
| Prior Publication US 2006/0238961 A1, Oct. 26, 2006 | ||
| Int. Cl. H01L 23/552 (2006.01); H01L 23/34 (2006.01) | ||
| U.S. Cl. 257—777 [257/660; 257/686; 257/706; 257/E23.114; 257/E25.013; 438/108; 438/109] | 11 Claims |
| 1. A circuit device comprising:
a substrate provided with ground wiring
a plurality of circuit elements laminated on said substrate;
a pair of insulation layers provided between at least one set of an upper-layer circuit element and a lower-layer circuit
element disposed adjacent to each other, among said plurality of circuit elements; and
a conductive layer interposed between said pair of insulation layers,
wherein the upper-layer circuit element connects to the ground wiring by way of said conductive layer;
the upper-layer circuit element, and a first wire connecting the upper-layer circuit element and the conductive layer are
sealed by a first encapsulating resin; and
the upper-layer circuit element sealed by the first encapsulating resin and a second wire connecting the conductive layer
and the ground wiring are sealed by a second encapsulating resin.
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