| US 7,452,797 B2 | ||
| Solder deposition method and solder bump forming method | ||
| Youichi Kukimoto, Kakogawa (Japan); Hitoshi Sakurai, Kakogawa (Japan); Seishi Kumamoto, Kakogawa (Japan); and Kenshu Oyama, Kakogawa (Japan) | ||
| Assigned to Harima Chemicals, Inc., Hyogo (Japan) | ||
| Filed on Jan. 29, 2004, as Appl. No. 10/765,931. | ||
| Claims priority of application No. 2003-110125 (JP), filed on Apr. 15, 2003. | ||
| Prior Publication US 2004/0209451 A1, Oct. 21, 2004 | ||
| Int. Cl. H01L 21/44 (2006.01) | ||
| U.S. Cl. 438—612 [438/613] | 15 Claims |
| 1. A solder deposition method comprising the steps of:
forming a dam around an electrode on a substrate;
applying a solder precipitating composition to said substrate; and
heating the resulting substrate so as to form a solder on the surface of said electrode,
wherein said solder precipitating composition comprises a tin powder and a silver or copper complex of at least one member
selected from the group consisting of aryl phosphines, alkyl phosphines and azoles.
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