| US 7,452,258 B1 | ||
| Method of sealing OLED cover with liquid adhesive | ||
| Vincent P. Marzen, Robins, Iowa (US); James D. Sampica, Springville, Iowa (US); and Paul R. Nemeth, Cedar Rapids, Iowa (US) | ||
| Assigned to Rockwell Collins, Inc., Cedar Rapids, Iowa (US) | ||
| Filed on Aug. 30, 2005, as Appl. No. 11/214,547. | ||
| Int. Cl. H01J 1/62 (2006.01); H01J 9/26 (2006.01) | ||
| U.S. Cl. 445—25 [313/512] | 10 Claims |
| 1. A method of adhering a substantially transparent protective cover to an organic light-emitting diode (OLED) assembly, the
OLED assembly including a substrate, the method comprising:
adhering the OLED assembly and the protective cover together using a first adhesive application, the first adhesive application
being applied to a perimeter region of a face of one of the OLED assembly and the protective cover;
applying a liquid adhesive, through a first opening in the liquid adhesive application, to substantially all of a volume defined
by the OLED assembly, the protective cover, and the first adhesive application;
providing a second opening in the first adhesive application to permit the evacuation of gases in the volume while liquid
adhesive is applied through the first opening into the volume;
while applying the liquid adhesive, positioning the OLED assembly and the protective cover such that gases displayed by the
application of liquid adhesive through the first opening freely exit the volume through the second opening; and
curing the liquid adhesive to adhere the protective cover to the OLED assembly.
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