US 11,818,958 B2
Vibration device
Koichi Mizugaki, Suwa (JP)
Assigned to SEIKO EPSON CORPORATION, Tokyo (JP)
Filed by SEIKO EPSON CORPORATION, Tokyo (JP)
Filed on Sep. 28, 2020, as Appl. No. 17/034,110.
Claims priority of application No. 2019-178838 (JP), filed on Sep. 30, 2019.
Prior Publication US 2021/0098682 A1, Apr. 1, 2021
Int. Cl. H10N 30/87 (2023.01); H10N 30/80 (2023.01); H10N 30/88 (2023.01); H03H 3/02 (2006.01); H03H 9/10 (2006.01)
CPC H10N 30/875 (2023.02) [H10N 30/802 (2023.02); H10N 30/88 (2023.02); H03H 3/02 (2013.01); H03H 9/1021 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A vibration device comprising:
a semiconductor substrate having a first surface and a second surface in an obverse-reverse relationship;
an integrated circuit disposed on the first surface;
a first terminal which is disposed on the second surface and to which a substrate potential is applied;
a second terminal which is disposed on the second surface and to which a potential different from the substrate potential is applied;
a first through electrode which penetrates the semiconductor substrate, and is configured to electrically couple the first terminal and the integrated circuit to each other;
a second through electrode which penetrates the semiconductor substrate, and is configured to electrically couple the second terminal and the integrated circuit to each other;
a frame which penetrates the semiconductor substrate, and has an insulating property;
a vibration element disposed on the first surface; and
a lid bonded to the first surface, wherein
the first through electrode is located outside the frame, and
the second through electrode is located inside the frame.