US 11,818,850 B2
Flux dotting tool
Seungjin Lee, Hwaseong-si (KR); and Jongbeom Park, Seoul (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Jan. 24, 2022, as Appl. No. 17/582,590.
Claims priority of application No. 10-2021-0085584 (KR), filed on Jun. 30, 2021.
Prior Publication US 2023/0007787 A1, Jan. 5, 2023
Int. Cl. B23K 1/00 (2006.01); H05K 3/40 (2006.01); B23K 1/20 (2006.01)
CPC H05K 3/4007 (2013.01) [B23K 1/203 (2013.01); H05K 2203/0126 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A flux dotting tool comprising:
a housing having an internal space and a plurality of through-holes extending from the internal space to an outside of the housing;
a plurality of flux pins disposed in the internal space to correspond to the plurality of through-holes, respectively, wherein each of the plurality of flux pins comprises a flux holding portion extending in a first direction and exposed to the outside of the housing, and a flux blocking structure that protrudes in a second direction, perpendicular to the first direction, from a side surface of the flux holding portion, and the flux blocking structure is configured to limit a flux wetting region; and
an elastic structure disposed on the plurality of flux pins in the internal space and configured to impart elastic force in the first direction,
wherein the flux holding portion comprises a wetting portion below the flux blocking structure and a non-wetting portion above the flux blocking structure,
wherein a height of the wetting portion in the first direction has a ratio within a range of 1 to 3 with respect to a minimum diameter of a tip surface of the wetting portion in the second direction, and
wherein a diameter of the flux blocking structure in the second direction has a ratio that is greater than 1 and equal to or less than 2 with respect to the minimum diameter of the wetting portion.