CPC H05K 3/389 (2013.01) [H05K 3/146 (2013.01); H05K 3/382 (2013.01); H05K 3/386 (2013.01); H05K 3/42 (2013.01); Y10T 29/49155 (2015.01)] | 20 Claims |
1. A method of improving the adhesion of a metal-organic interface in an electronic device, comprising:
providing a substrate with a metal structure formed thereon;
treating a surface of the metal structure with a vapor of a silane composition to deposit a silane mono-layer on the metal structure, wherein the silane composition includes at least one of
(i.)N-(2-Aminoethyl)-3-aminopropyltrimethoxysilane (AE-APTMS),
(ii.) N,N′-Bis[(3-trimethoxysilyl)propyl]ethylenediamine (TMSP-ED),
(iii.) Bis(3-Trimethoxysilylpropyl)amine, (TMSPA),
(iv.) 3-Mercaptopropyltrimethoxysilane (MPTMS),
(v.)N-(2-Aminoethyl)-3-aminopropylsilanetriol, 25% in water (AE-APST),
(vi.) 3-Thiocyanatopropyltriethoxysilane, 92% (TCPTES),
(vii.)N-(6-Aminohexyl)aminomethyl trimethoxysilane,
(viii.) 1,3-Bis(3-aminopropyl)tetramethyldisiloxane,
(ix.) Bis[3-(triethoxysilyl)propyl]disulfide, 90% (TESPDS),
(x.) Cysteamine,
(xi.) 3-Aminopropanethiol,
(xii.) Aminoethylaminopropyl/methylsilsesquioxane, in aqueous solution,
(xiii.) Aminopropylsilsesquioxane in aqueoussolution (APS),
(xiv.) (2-Diethylphosphatoethyltriethoxysilane),
(xv.) (2-Diethylphosphatoethyl)methyldiethoxysilane,
(xvi.)N-(2-Aminoethyl)-3-Aminopropyltriethoxysilane,
(xvii.) (3-(M-AMINOPHENOXY) PROPYLTRIMETHOXYSILANE,
(xviii.)N-(2-Aminoethyl)-3-Aminopropylmethyldimethoxysilane,
(xix.)N-(2-Aminoethyl)-3-Aminoisobutylmethyldimethoxysilane,
(xx.)N-(2-Aminoethyl)-3-Aminoisobutyldimethylmethoxysilane,
(xxi.) 4-Aminobutyltriethoxysilane,
(xxii.) (Aminoethylaminomethyl)Phenethyltrimethoxysilane,
(xxiii.)N-(2-Aminoethyl)-3-Aminopropylmethyldiethoxysilane,
(xxiv.)N-(2-Aminoethyl)-11-Aminoundecyltrimethoxysilane,
(xxv.)N-(6-Aminohexyl)Aminopropyltrimethoxysilane,
(xxvi.)N-(6-Aminohexyl)Aminopropyltrimethoxysilane,
(xxvii.) m-AMINOPHENYLTRIMETHOXYSILANE, or
(xxviii.) m-AMINOPHENYLTRIMETHOXYSILANE; and
after treating the surface of the metal structure, coating the treated surface with an organic material, wherein the metal-organic interface between the treated surface of the metal structure and the coated organic layer has improved adhesion.
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