US 11,818,841 B2
Printed circuit board
Hae Kyo Seo, Suwon-si (KR); and Jin Won Lee, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Jul. 9, 2021, as Appl. No. 17/371,800.
Claims priority of application No. 10-2021-0053782 (KR), filed on Apr. 26, 2021.
Prior Publication US 2022/0346230 A1, Oct. 27, 2022
Int. Cl. H05K 1/11 (2006.01); H05K 1/02 (2006.01)
CPC H05K 1/112 (2013.01) [H05K 1/0222 (2013.01); H05K 1/115 (2013.01); H05K 1/025 (2013.01); H05K 1/0218 (2013.01); H05K 1/111 (2013.01)] 21 Claims
OG exemplary drawing
 
1. A printed circuit board, comprising:
a core layer;
a through portion penetrating through an upper surface and a lower surface of the core layer;
a first via disposed to be spaced apart from an inner surface of the through portion within the through portion;
a second via disposed inside the first via, and having a diameter, different from that of the first via;
an insulating material disposed between the first via and the inner surface of the through portion; and
a first via pad disposed on the first via,
wherein the first via pad is in contact with the core layer, the insulating material, and the first via.