US 11,817,724 B2
Enclosure system with charging assembly
Phillip Alfred Criminale, Liberty Hill, TX (US); Zhiqiang Guo, San Jose, CA (US); Andrew S. C. Ho, Liberty Hill, TX (US); Rachel Sara Stolzman, Saratoga, CA (US); and Michael Carl Hankes, Austin, TX (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Mar. 2, 2022, as Appl. No. 17/685,112.
Prior Publication US 2023/0283086 A1, Sep. 7, 2023
Int. Cl. H01M 10/44 (2006.01); H01M 10/46 (2006.01); H02J 7/00 (2006.01)
CPC H02J 7/00034 (2020.01) [H02J 7/0044 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An enclosure system comprising:
a plurality of walls forming an interior volume, wherein the enclosure system is configured to couple to an equipment front end module (EFEM) of a substrate processing system;
a charging assembly comprising a first charging coil; and
one or more first support structures disposed within the interior volume under the first charging coil, wherein the one or more first support structures are configured to support a first validation wafer within a threshold distance of the first charging coil to charge the first validation wafer via the charging assembly.
 
16. A method comprising:
receiving a first subset of sensor data from a validation wafer configured to be transferred by a robot of an equipment front end module (EFEM) of a substrate processing system from one or more support structures disposed in an interior volume formed by an enclosure system, wherein the first subset is associated with at least a charge state of an electrical storage device of the validation wafer;
receiving a second subset of the sensor data from a charging assembly of the enclosure system, wherein the charging assembly is configured to charge the validation wafer responsive to the validation wafer being disposed on the one or more support structures; and
causing, based on the sensor data, performance of a corrective action associated with the substrate processing system.