CPC H02J 7/00034 (2020.01) [H02J 7/0044 (2013.01)] | 20 Claims |
1. An enclosure system comprising:
a plurality of walls forming an interior volume, wherein the enclosure system is configured to couple to an equipment front end module (EFEM) of a substrate processing system;
a charging assembly comprising a first charging coil; and
one or more first support structures disposed within the interior volume under the first charging coil, wherein the one or more first support structures are configured to support a first validation wafer within a threshold distance of the first charging coil to charge the first validation wafer via the charging assembly.
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16. A method comprising:
receiving a first subset of sensor data from a validation wafer configured to be transferred by a robot of an equipment front end module (EFEM) of a substrate processing system from one or more support structures disposed in an interior volume formed by an enclosure system, wherein the first subset is associated with at least a charge state of an electrical storage device of the validation wafer;
receiving a second subset of the sensor data from a charging assembly of the enclosure system, wherein the charging assembly is configured to charge the validation wafer responsive to the validation wafer being disposed on the one or more support structures; and
causing, based on the sensor data, performance of a corrective action associated with the substrate processing system.
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