CPC H01R 4/029 (2013.01) [H01B 1/02 (2013.01); H01R 4/58 (2013.01); H01R 43/0207 (2013.01)] | 7 Claims |
1. Method of manufacturing an electrical connection comprising:
providing a carrier substrate of a metallic material, wherein the carrier substrate has at least a first and a second surface and wherein the first surface and the second surface are located on opposing sides of the carrier substrate;
applying a coating comprising an electrically non-conductive barrier material on the first surface of the carrier substrate such that the coating barrier material covers only a partial area of the first surface;
coating the carrier substrate on the first surface and the second surface with a metallic coating material, wherein the coating barrier material substantially prevents coating of said carrier substrate with said applied metallic coating material in said partial area;
placing the carrier substrate with the partial area onto an anvil or a sonotrode of an ultrasonic welding tool, such that a relief-shaped surface of the anvil or the sonotrode abut the coating barrier material within said partial area; and
materially bonding, with the ultrasonic welding tool, an electrical conductor to the second surface coated with the metallic coating material, the second surface facing away from the first surface.
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