US 11,817,536 B2
Method for making electronic device arrays using a temporary substrate and a carrier substrate
David Trung Doan, Baoshan Township, Hsinchu County (TW); and Trung Tri Doan, Baoshan Township, Hsinchu County (TW)
Assigned to SemiLEDs Optoelectronics Co., Ltd., Chu-nan (TW)
Filed by SemiLEDs Optoelectronics Co., Ltd, Chu-nan (TW)
Filed on Feb. 21, 2022, as Appl. No. 17/676,334.
Application 17/676,334 is a continuation of application No. 17/078,323, filed on Oct. 23, 2020, granted, now 11,387,397.
Application 17/078,323 is a continuation of application No. 16/139,292, filed on Sep. 24, 2018, granted, now 10,910,535, issued on Feb. 2, 2021.
Prior Publication US 2022/0278261 A1, Sep. 1, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 33/62 (2010.01); H01L 25/16 (2023.01); H01L 33/52 (2010.01); H01L 25/075 (2006.01); H01L 33/00 (2010.01)
CPC H01L 33/62 (2013.01) [H01L 25/0753 (2013.01); H01L 25/167 (2013.01); H01L 33/0093 (2020.05); H01L 33/52 (2013.01); H01L 33/0095 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0066 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A method for making electronic device arrays comprising:
providing a plurality of separate electronic devices;
providing a carrier substrate and a temporary substrate attached to the carrier substrate, the carrier substrate configured as a support substrate for supporting the electronic devices and the temporary substrate configured as an attaching substrate for attaching the electronic devices to the support substrate;
attaching the electronic devices to the temporary substrate;
forming one or more insulator layers on the electronic devices while attached to the temporary substrate;
forming one or more metal layers configured to electrically connect the electronic devices to form a desired circuitry; and
separating the electronic devices along with the metal layers and the insulator layers from the carrier substrate and the temporary substrate.