US 11,817,467 B2
Solid-state imaging device and electronic device
Yoshihiro Makita, Kanagawa (JP)
Assigned to Sony Semiconductor Solutions Corporation, Kanagawa (JP)
Appl. No. 17/283,147
Filed by SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
PCT Filed Sep. 12, 2019, PCT No. PCT/JP2019/035824
§ 371(c)(1), (2) Date Apr. 6, 2021,
PCT Pub. No. WO2020/079997, PCT Pub. Date Apr. 23, 2020.
Claims priority of application No. 2018-194269 (JP), filed on Oct. 15, 2018.
Prior Publication US 2021/0391367 A1, Dec. 16, 2021
Int. Cl. H01L 27/146 (2006.01); H01L 23/13 (2006.01); H01L 23/00 (2006.01)
CPC H01L 27/14618 (2013.01) [H01L 23/13 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 27/14636 (2013.01); H01L 2224/32057 (2013.01); H01L 2224/32237 (2013.01); H01L 2224/73204 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A solid-state imaging device comprising:
a solid-state imaging element having a pixel region which is a light receiving region including a large number of pixels on a surface side which is one plate surface of a semiconductor substrate;
a substrate provided on the surface side with respect to the solid-state imaging element and having an opening for passing light to be received by the pixel region; and
an underfill part formed including a cured fluid and covering a connection part that electrically connects the solid-state imaging element and the substrate,
wherein the substrate has a groove for guiding the fluid forming the underfill part in a direction away from the surface of the solid-state imaging element, on a surface portion forming the opening.