US 11,817,415 B2
Thermal bonding sheet and thermal bonding sheet with dicing tape
Satoshi Honda, Ibaraki (JP); Yuki Sugo, Ibaraki (JP); and Nao Kamakura, Ibaraki (JP)
Assigned to NITTO DENKO CORPORATION, Ibaraki (JP)
Appl. No. 16/308,931
Filed by NITTO DENKO CORPORATION, Ibaraki (JP)
PCT Filed May 23, 2017, PCT No. PCT/JP2017/019187
§ 371(c)(1), (2) Date Dec. 11, 2018,
PCT Pub. No. WO2017/221613, PCT Pub. Date Dec. 28, 2017.
Claims priority of application No. 2016-125317 (JP), filed on Jun. 24, 2016; and application No. 2017-046481 (JP), filed on Mar. 10, 2017.
Prior Publication US 2019/0148331 A1, May 16, 2019
Int. Cl. C09J 1/00 (2006.01); H01L 23/00 (2006.01); C09J 7/10 (2018.01); C09J 7/38 (2018.01); C09J 9/02 (2006.01); C09J 11/04 (2006.01); H01J 37/28 (2006.01); H01L 21/52 (2006.01); H01L 21/683 (2006.01); H01L 21/78 (2006.01); C08K 3/08 (2006.01); C08K 3/10 (2018.01); C09J 9/00 (2006.01)
CPC H01L 24/32 (2013.01) [C09J 1/00 (2013.01); C09J 7/10 (2018.01); C09J 7/385 (2018.01); C09J 9/00 (2013.01); C09J 9/02 (2013.01); C09J 11/04 (2013.01); H01J 37/28 (2013.01); H01L 21/52 (2013.01); H01L 21/6836 (2013.01); H01L 21/78 (2013.01); H01L 24/27 (2013.01); H01L 24/83 (2013.01); C08K 3/08 (2013.01); C08K 3/10 (2013.01); C09J 2203/326 (2013.01); C09J 2301/408 (2020.08); C09J 2400/16 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83203 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01079 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A thermal bonding sheet, comprising a precursor layer that is to become a sintered layer by heating,
wherein
the precursor layer includes sinterable metallic particles and an organic component,
the precursor layer has a phase separation structure that is a sea-island structure or a co-continuous structure,
in a SEM surface observation image on at least one surface of the precursor layer, a maximum value among each diameter of the largest inscribed circle for a region occupied by each phase of the phase separation structure is 1 μm or more and 50 μm or less, and
the phase separation structure is formed between a phase in which the sinterable metallic particles aggregate and a phase in which the organic component aggregates.