CPC H01L 24/05 (2013.01) [H01L 21/565 (2013.01); H01L 23/3142 (2013.01); H01L 24/45 (2013.01); H01L 24/85 (2013.01); H01L 2224/0569 (2013.01); H01L 2924/301 (2013.01)] | 21 Claims |
1. A molded semiconductor package, comprising:
a first semiconductor die attached to a first substrate, the first semiconductor die comprising a first bond pad at a first side of the first semiconductor die which faces away from the first substrate and an insulating layer covering the first side;
an electrical conductor attached to a part of the first bond pad exposed by an opening in the insulating layer;
a mold compound encasing the first semiconductor die; and
an electrically insulative material filling the opening in the insulating layer and sealing the part of the first bond pad exposed by the opening in the insulating layer,
wherein the electrically insulative material separates the mold compound from the part of the first bond pad exposed by the opening in the insulating layer.
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