CPC H01L 24/02 (2013.01) [H01L 23/525 (2013.01); H01L 23/5283 (2013.01); H01L 21/76885 (2013.01); H01L 2224/024 (2013.01); H01L 2224/0235 (2013.01); H01L 2224/0239 (2013.01); H01L 2224/02313 (2013.01); H01L 2224/02317 (2013.01); H01L 2224/02351 (2013.01); H01L 2224/02373 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05008 (2013.01); H01L 2224/05541 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/13147 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/05042 (2013.01); H01L 2924/14 (2013.01); H01L 2924/3511 (2013.01)] | 20 Claims |
1. An integrated circuit (IC) device comprising:
a redistribution line over a substrate, wherein an entire sidewall of the redistribution line is curved;
a passivation layer over the redistribution line, wherein a distance from a bottommost surface of the passivation layer to the substrate is less than a distance from a bottommost surface of the redistribution line to the substrate; and
a polymer layer over the passivation layer.
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