US 11,817,393 B2
Semiconductor die assemblies with decomposable materials and associated methods and systems
Fatma Arzum Simsek-Ege, Boise, ID (US); Luoqi Li, Boise, ID (US); and Marsela Pontoh, Boise, ID (US)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on Sep. 1, 2021, as Appl. No. 17/463,994.
Prior Publication US 2023/0069261 A1, Mar. 2, 2023
Int. Cl. H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2023.01)
CPC H01L 23/5385 (2013.01) [H01L 23/31 (2013.01); H01L 23/5384 (2013.01); H01L 23/5386 (2013.01); H01L 25/0657 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor die assembly, comprising:
a first semiconductor die including a first side and a second side opposite to the first side;
one or more second semiconductor dies attached to the first side, the one or more second semiconductor dies operatively coupled to the first semiconductor die; and
a biodegradable structure attached to the second side, the biodegradable structure including a conductive material operatively coupled to the first semiconductor die and an insulating material, wherein both the conductive material and the insulating material are biodegradable and configured to disintegrate in a wet process.