US 11,817,377 B2
Electronics unit with integrated metallic pattern
Romain Coffy, Voiron (FR); and Fabien Quercia, Saint Marcelin (FR)
Assigned to STMicroelectronics (Grenoble 2) SAS, Grenoble (FR)
Filed by STMicroelectronics (Grenoble 2) SAS, Grenoble (FR)
Filed on Aug. 1, 2022, as Appl. No. 17/878,436.
Application 17/878,436 is a division of application No. 17/165,295, filed on Feb. 2, 2021, granted, now 11,437,306.
Claims priority of application No. 2001103 (FR), filed on Feb. 4, 2020.
Prior Publication US 2022/0367330 A1, Nov. 17, 2022
Int. Cl. H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/552 (2006.01); H01L 23/66 (2006.01); H01L 23/00 (2006.01); H01Q 1/22 (2006.01)
CPC H01L 23/49811 (2013.01) [H01L 21/4817 (2013.01); H01L 21/4853 (2013.01); H01L 23/552 (2013.01); H01L 23/66 (2013.01); H01L 24/48 (2013.01); H01Q 1/2283 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/48227 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A method, comprising:
mounting at least one electronic integrated circuit chip on a bearing surface of a support substrate;
fixing first ends of a plurality of U-shaped metal wires onto the bearing surface at a side of said at least one electronic integrated circuit chip;
forming a metallic pattern at least on an internal wall of a non-conductive encapsulation cover;
locally forming a portion of solder on said metallic pattern;
mounting the non-conductive encapsulation cover on said bearing surface of the support substrate such that the internal wall is positioned opposite the bearing surface and second ends of the U-shaped metal wires are in contact with the locally formed portion of solder; and
after mounting, raising a temperature of said locally formed portion of solder so as to effectuate a soldering of said second ends of the U-shaped metal wires onto the metallic pattern.