US 11,817,369 B2
Lids for integrated circuit packages with solder thermal interface materials
Bamidele Daniel Falola, Chandler, AZ (US); Susmriti Das Mahapatra, Tempe, AZ (US); Sergio Antonio Chan Arguedas, Chandler, AZ (US); Peng Li, Chandler, AZ (US); and Amitesh Saha, Phoenix, AZ (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by INTEL CORPORATION, Santa Clara, CA (US)
Filed on Jun. 7, 2019, as Appl. No. 16/435,355.
Prior Publication US 2020/0388554 A1, Dec. 10, 2020
Int. Cl. H01L 23/42 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01); H01L 23/522 (2006.01); H01L 25/065 (2023.01); H01L 23/00 (2006.01)
CPC H01L 23/42 (2013.01) [H01L 23/3675 (2013.01); H01L 23/3736 (2013.01); H01L 23/5226 (2013.01); H01L 25/0652 (2013.01); H01L 24/09 (2013.01); H01L 24/17 (2013.01); H01L 2924/15311 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An integrated circuit (IC) package, comprising:
a package substrate;
a die;
a lid, wherein the lid includes nickel, and the die is between the package substrate and the lid;
a solder thermal interface material (STIM) between the die and the lid;
an intermetallic compound (IMC) between the STIM and the nickel; and
an intermediate material between the nickel and the IMC, wherein the intermediate material includes vanadium, titanium, zirconium, tungsten, cerium, hafnium, tantalum, yttrium, niobium, or molybdenum.