CPC H01L 23/42 (2013.01) [H01L 23/3675 (2013.01); H01L 23/3736 (2013.01); H01L 23/5226 (2013.01); H01L 25/0652 (2013.01); H01L 24/09 (2013.01); H01L 24/17 (2013.01); H01L 2924/15311 (2013.01)] | 20 Claims |
1. An integrated circuit (IC) package, comprising:
a package substrate;
a die;
a lid, wherein the lid includes nickel, and the die is between the package substrate and the lid;
a solder thermal interface material (STIM) between the die and the lid;
an intermetallic compound (IMC) between the STIM and the nickel; and
an intermediate material between the nickel and the IMC, wherein the intermediate material includes vanadium, titanium, zirconium, tungsten, cerium, hafnium, tantalum, yttrium, niobium, or molybdenum.
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