US 11,817,335 B2
Method and system for inspecting processing apparatus
Kippei Sugita, Miyagi (JP); and Kenji Nagai, Miyagi (JP)
Assigned to TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Sep. 3, 2020, as Appl. No. 17/010,885.
Claims priority of application No. 2019-163018 (JP), filed on Sep. 6, 2019.
Prior Publication US 2021/0074564 A1, Mar. 11, 2021
Int. Cl. G01N 21/25 (2006.01); G01N 21/45 (2006.01); H01L 21/67 (2006.01); G01N 21/95 (2006.01); G01B 5/00 (2006.01); G01K 11/125 (2021.01)
CPC H01L 21/67253 (2013.01) [G01B 5/0014 (2013.01); G01K 11/125 (2013.01); G01N 21/25 (2013.01); G01N 21/45 (2013.01); G01N 21/9501 (2013.01); H01L 21/67248 (2013.01); H01L 21/67288 (2013.01)] 21 Claims
OG exemplary drawing
 
1. A system configured to inspect a processing apparatus, comprising:
a temperature adjusting device configured to adjust a temperature of a component within a processing chamber of the processing apparatus;
a light source configured to emit measurement light;
multiple optical elements configured to output the measurement light emitted from the light source to the component within the processing chamber of the processing apparatus as output light and configured to receive reflected light from the component during a temperature adjustment of the component by the temperature adjusting device;
a light receiving element configured to receive the light from the multiple optical elements and measure a spectrum of the light; and
a controller configured to calculate temperatures of the component at measurement points respectively corresponding to the multiple optical elements based on the spectrum of the light measured by the light receiving element, and make a determination upon abnormality of the processing apparatus based on comparisons of the temperatures of the component at the respective measurement points,
wherein the temperatures are obtained from the same component at a same time.