US 11,817,334 B2
Substrate processing apparatus and substrate processing method
Haruka Kaneko, Miyagi (JP); Takehiko Arita, Miyagi (JP); and Hayato Sakai, Miyagi (JP)
Assigned to TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Feb. 11, 2021, as Appl. No. 17/173,566.
Claims priority of application No. 2020-026260 (JP), filed on Feb. 19, 2020.
Prior Publication US 2021/0257235 A1, Aug. 19, 2021
Int. Cl. H01L 21/67 (2006.01); H05B 3/00 (2006.01)
CPC H01L 21/67248 (2013.01) [H01L 21/67109 (2013.01); H01L 21/67253 (2013.01); H05B 3/0014 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A system of processing a substrate, comprising:
substrate-processing chambers;
target components of temperature control disposed in the respective substrate-processing chambers;
a chiller to supply a first temperature-controlling medium with a first flow rate and a second temperature-controlling medium with a second flow rate into the target components;
flow controllers connected to the respective target components, each flow controller being configured to independently control a ratio of the first flow rate to the second flow rate to be fed into the corresponding target component from the chiller,
wherein the chiller comprises a first thermoregulator to control the first temperature-controlling medium to a first temperature and a second thermoregulator to control the second temperature-controlling medium to a second temperature, the second temperature being higher than the first temperature,
the first thermoregulator has a first inlet port to supply the controlled first temperature-controlling medium to the respective target components and the first outlet port to recover the first temperature-controlling medium from the target components, and
the second thermoregulator has a second inlet port to supply the controlled second temperature-controlling medium to the respective target components and the second outlet port to recover the second temperature-controlling medium from the target components,
wherein the system further comprises:
first supply channels disposed between the first inlet port and the flow controllers, respectively;
first recovery channels disposed between the first outlet port and the flow controllers, respectively;
second supply channels disposed between the second inlet port and the flow controllers, respectively; and
second recovery channels disposed between the second outlet port and the flow controllers, respectively,
wherein the first inlet port and the first outlet port are disposed in a center of the first thermoregulator;
the first supply channels have a first height, and the first recovery channels have a second height differing from the first height;
the second inlet port and the second outlet port are disposed in a center of the second thermoregulator; and
the second supply channels have a third height, and the second recovery channels have a fourth height differing from the third height.