US 11,817,326 B2
Precision reconstruction for panel-level packaging
Amlan Sen, Singapore (SG); Chian Soon Chua, Singapore (SG); Qing Feng Guan, Singapore (SG); and Wai Hoe Lee, Singapore (SG)
Assigned to PYXIS CF PTE. LTD., Singapore (SG)
Filed by PYXIS CF PTE. LTD., Singapore (SG)
Filed on Oct. 4, 2021, as Appl. No. 17/492,694.
Application 17/492,694 is a continuation in part of application No. 16/814,961, filed on Mar. 10, 2020.
Claims priority of application No. 10202009834T (SG), filed on Oct. 2, 2020.
Prior Publication US 2022/0028703 A1, Jan. 27, 2022
Int. Cl. H01L 21/56 (2006.01); H01L 21/66 (2006.01)
CPC H01L 21/561 (2013.01) [H01L 22/20 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A method for a die location check (DLC) comprising:
providing a reconstructed wafer having a block of dies encased in a mold compound, the block of dies includes a plurality of dies arranged in rows and columns to form a matrix of dies of the block, wherein the plurality of dies includes alignment dies and live dies;
scanning the reconstructed wafer, wherein the scanning comprises scanning the block of dies; and
processing scan information of the block of dies, wherein the processing comprises
identifying positions of the alignment dies of the block of dies,
assigning one of the alignment dies of the block of dies as an origin point of a Cartesian coordinate system of the block of dies,
wherein scanning the block of dies includes scanning sub-blocks of dies one sub-block at a time, wherein each sub-block of dies includes the dies arranged in a sub-block matrix, the sub-block matrix includes a smaller number of dies than the matrix of the block of dies, and
assigning coordinate points for the sub-blocks of dies in the Cartesian coordinate system.